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Professional SMT peripheral automation equipment R & D / production / sales

Focused on: PCB&FPC splitting, FPC pulse hot pressing welding; Fully automatic intelligent unmanned

dividing and welding production line

National Service Hotline：400-832-9322

PCB laser splitting machine XJ-E520A
Laser splitting machine, used for cutting FPC, PCBA, covering film window opening, cutting complex graphics, high accuracy, stable performance, and better cost-effectiveness.
  • Product Details
Characteristics of PCB laser splitting machine XJ-E520A:
1. Equipped with a high peak power 15W 355nm ultraviolet laser, the power is stable with small attenuation, and there is no need to worry about the impact of power attenuation on cutting quality and speed;
2. Integrated CTI high-precision scanning galvanometer and Yokogawa high-precision linear motor platform, with high operating accuracy;
3. Professional cutting software can directly import DXF graphics made by CAD, and accurately cut according to the input graphics, leading to precise and efficient cutting;
4. After optimizing the design of the optical path, the speed and effect can be optimized at the same power level, and efficient dust prevention treatment can be carried out to effectively reduce equipment downtime, cleaning and maintenance cycles;
5. The equipment adopts a marble shockproof platform, with a stable and solid overall structure, and an integrated closed structure, providing guarantee for high-speed, high-precision, and high yield production; The software is compatible with various types of functions, easy to operate, easy to learn and understand, and can learn basic operations in a short time;
6. Suitable for SMT production lines, mainly used for cutting FPC, PCB, fingerprint module, camera module, TYPE-C interface, and various precision PCB/FPC boards with corresponding stress requirements in the 3C industry production.
Technical parameters of PCB laser splitting machine XJ-E520A:
1. Cutting area: 350 * 350MM
2. Galvanometer scanning range: 42 * 42MM
3. Positioning accuracy: ± 0.02MM
4. Cutting accuracy: ± 0.02MM
5. Cutting thickness: 0-2.0MM
6. Platform movement speed: 0-1000mm/s
7. Laser: 15W UV solid-state laser
8. Motion control: PC+motion control card+vision+linear motor platform
9. Scanning galvanometer: imported from the United States
10. Cutting platform: marble platform
11. Water chiller: XONJE patent
11. Working voltage: AC380 4KW
12. Weight: 1200KG
13. Overall dimensions: 1100 length * 1200 width * 1650mm height
Case Study of Laser Splitter XJ-E520A:


PCB laser splitting machine XJ-E520A video:




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